Frank Stepniak: search on Z-Library

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1

Conversion of the under bump metallurgy into intermetallics: the impact on flip chip reliability

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 478 KB

english, 2001

2

Mechanical loading of flip chip joints before underfill: the impact on yield and reliability

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 500 KB

english, 2004

3

Failure criteria of flip chip joints during accelerated testing

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 247 KB

english, 2002

4

The electronic nature of the metal-metal quadruple bond: variable photon energy photoelectron spectroscopy of Mo2(O2CCH3)4

Lichtenberger, Dennis L., Ray, Charles D., Stepniak, Frank, Chen, Yu, Weaver, J. H.

Journal:

Journal of the American Chemical Society

Year:

1992

Language:

english

File:

PDF, 1.29 MB

english, 1992

5

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Fabrication and Integration of Ultrathin, High-Density, High-Frequency Ta Capacitors on Silicon for Power Modules

Chakraborti, Parthasarathi, Neuhart, Nathan, Rataj, Kamil-Paul, Schnitter, Christoph, Gandhi, Saumya, Sharma, Himani, Raj, P. M., Stepniak, Frank, Romig, Matt, Lollis, Naomi, Tummala, Rao R.

Year:

2016

Language:

english

File:

PDF, 653 KB

english, 2016

6

SAE Technical Paper Series [SAE International SAE 2002 World Congress & Exhibition - (MAR. 04, 2002)] SAE Technical Paper Series - Wafer Applied Underfill – Delivering Flip Chip to the Mainstream

Chaudhuri, Arun K., Walsh, Matthew R., Stepniak, Frank, Post, Scott, Zenner, Robert L. D., Kropp, Michael A., Charles, Scott B., Kinney, Robert B., Li, F. Bruce

Year:

2002

Language:

english

File:

PDF, 395 KB

english, 2002